Description

Name: Thermal conductive silicon Thermal conductivity: 4.8W/M-K Specification: - GD900-SY1 1G/3G - GD007-SY1 1G/3G Purpose: Can be used for thermal and heat dissipation of electronic components, CPUs, GPUs, MOS tubes, LEDs, temperature controllers, etc. Easy to apply (no need to spread before heatsink installation) and easy to clean with dry paper towel or tissue (no cleaning alcohol required) 1G Syringe: 36 cedis 3G Syringe: 46 cedis